Thin integrated circuit package having an optically...

Details Thin integrated circuit package having an optically... Thin integrated circuit package having an optically...

2002-02-06

2004-08-31

Cuneo, Kamand (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S778000

Reexamination Certificate

active

06784534

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates generally to integrated circuit packaging, and more specifically, to a thin integrated circuit package having an optically transparent window.
BACKGROUND OF THE INVENTION
Optical integrated circuits are increasing in use to provide imaging, coupling and other optical functions for devices such as digital cameras, video cellular telephones, and other devices.
Digital cameras and cellular telephones are being fabricated in increasingly smaller and thinner packages, increasing market pressure on the semiconductor and subassembly manufacturers to supply thinner and smaller integrated circuit packages.
Optical integrated circuits are necessarily manufactured with a transparent cover that provides access to the optical functions on the integrated circuit die, while protecting the die from contamination and damage. Typically, the transparent cover is incorporated within a molded covering a lead frame carrier, yielding a thick industry-standard package.
Therefore, it would be desirable to provide a thin integrated circuit package incorporating an optically transparent window.
SUMMARY OF THE INVENTION
The objective of providing a thin integrated circuit having an optically transparent window is accomplished in an integrated circuit assembly and a method for manufacturing an integrated circuit assembly.
An integrated circuit die is mounted on a tape having metal conductors on its surface and electrical interconnects disposed on a side opposite the die. The interconnects may be solder balls or other suitable electrical mounting interconnects. The die is surrounded by a thin supporting structure to which the tape is mounted. A glass cover is mounted over the die, to either the supporting structure or to the top of the die.
The present invention is best understood by reference to the following detailed description when read in conjunction with the accompanying drawings.


REFERENCES:
patent: 3018689 (1962-01-01), Saxe
patent: 3838984 (1974-10-01), Crane et al.
patent: 4293190 (1981-10-01), Clover
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4760440 (1988-07-01), Bigler et al.
patent: 4801998 (1989-01-01), Okuaki
patent: 5057905 (1991-10-01), Matsumoto et al.
patent: 5070041 (1991-12-01), Katayama et al.
patent: 5117279 (1992-05-01), Karpman
patent: 5122862 (1992-06-01), Kajihara et al.
patent: 5159432 (1992-10-01), Ohkubo et al.
patent: 5230759 (1993-07-01), Hiraiwa
patent: 5256901 (1993-10-01), Ohahi et al.
patent: 5258094 (1993-11-01), Furui et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5436203 (1995-07-01), Lin
patent: 5463253 (1995-10-01), Waki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5497032 (1996-03-01), Tsuji et al.
patent: 5529959 (1996-06-01), Yamanaka
patent: 5579164 (1996-11-01), Chapnik
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5644169 (1997-07-01), Chun
patent: 5656857 (1997-08-01), Kishita
patent: 5674785 (1997-10-01), Akram et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5798014 (1998-08-01), Weber
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5861680 (1999-01-01), Yamanaka
patent: 5866953 (1999-02-01), Akram et al.
patent: 5867368 (1999-02-01), Glenn
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 5877546 (1999-03-01), You
patent: 5893723 (1999-04-01), Yamanaka
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5895222 (1999-04-01), Moden et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5905301 (1999-05-01), Ichikawa et al.
patent: 5949655 (1999-09-01), Glenn
patent: 5950074 (1999-09-01), Glenn et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 5962810 (1999-10-01), Glenn
patent: 5972738 (1999-10-01), Vongfuangfoo et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5989941 (1999-11-01), Wensel
patent: 5998862 (1999-12-01), Yamanaka
patent: 6011294 (2000-01-01), Wetzel
patent: 6013948 (2000-01-01), Akram et al.
patent: 6034427 (2000-03-01), Lan et al.
patent: 6034429 (2000-03-01), Glenn et al.
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6092281 (2000-07-01), Glenn
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6147389 (2000-11-01), Stern et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6214641 (2001-04-01), Akram
patent: 6235554 (2001-05-01), Akram et al.
patent: 6262479 (2001-07-01), Chou
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6395578 (2002-05-01), Shin et al.
patent: 6403881 (2002-06-01), Hughes
patent: 6528892 (2003-03-01), Caletka et al.
patent: 43 19 786 (1993-06-01), None
patent: 9510862026 (1995-06-01), None
patent: 53-127101 (1978-10-01), None
patent: 54-095006 (1979-07-01), None
patent: 56-209264 (1981-12-01), None
patent: 58-040579 (1983-03-01), None
patent: 60-160257 (1985-07-01), None
patent: 60-288127 (1985-12-01), None
patent: 61-273445 (1986-11-01), None
patent: 62-185911 (1987-07-01), None
patent: 62-211993 (1987-08-01), None
patent: 05136323 (1993-01-01), None
patent: 05109975 (1993-03-01), None
patent: 06-102369 (1994-05-01), None
patent: 59-167037 (1994-09-01), None
patent: 07-110380 (1995-05-01), None
patent: 08-124888 (1996-05-01), None
patent: 10-173085 (1998-06-01), None

Affiliated with

Also associated with

Rating

Thin integrated circuit package having an optically... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin integrated circuit package having an optically..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin integrated circuit package having an optically... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3274029