Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Examiner
active
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150 degree bump placement layout for an integrated circuit...
Angled edge connections for multichip structures
Anisotropic stress buffer and semiconductor device using the...
Apparatus and methods of testing and assembling bumped...
Apparatus and methods of testing and assembling bumped...
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Profile ID: LFUS-PAI-P-398596