Thin film transistor substrate manufactured through 3-sheet...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S151000, C257SE29151

Reexamination Certificate

active

07820496

ABSTRACT:
A thin film transistor substrate and method of manufacturing a thin film transistor substrate through a 3-sheet mask process includes forming a first conductive film on a substrate; forming a gate line including a gate electrode using a first photoresist film pattern formed on the first conductive film through a first mask with a desired pattern formed thereon; sequentially forming a gate insulation film, an active layer, an ohmic contact layer, a second conductive film and a protection film on an entire surface of the substrate; forming an active region and a data line including source-drain electrodes using a second photoresist film pattern that has different thicknesses in predetermined regions and is formed on the protection film through a second mask with a desired pattern formed thereon; forming a contact hole by exposing a channel region of the active layer and partially exposing the source-drain electrodes using the second photoresist pattern; forming a third conductive film on the entire surface of the substrate; and forming a pixel electrode to be connected to the contact hole using a third photoresist film pattern formed on the third conductive film through a third mask with a desired pattern formed thereon. The present invention further provides a liquid crystal display having the same.

REFERENCES:
patent: 2004/0126917 (2004-07-01), Yoo et al.
patent: 2004/0134878 (2004-07-01), Matsushita et al.
patent: 2004/0183955 (2004-09-01), Souk et al.
Chinese Office Action with English Translation for Chinese Patent Application No. 200710003746.8 dated Nov. 13, 2009.

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