Thin film transistor substrate and its manufacture

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257S408000, C257S407000

Reexamination Certificate

active

06964891

ABSTRACT:
A semiconductor layer with a threshold voltage for n-channel is formed and patterned to TFT island areas. A gate insulating film is deposited. The first gate electrode layer is formed and pattered to form an opening. Phosphorous ions are implanted into a p-channel TFT in the opening to set threshold voltage for p-channel TFT. A second gate electrode layer is formed and patterned to form second gate electrodes. By using the first gate electrode layer as a mask, boron ions are implanted at a high concentration to form source/drain regions of the p-channel TFT. By using the second gate electrodes as a mask, the first gate electrode layer is etched to form gate electrodes. Phosphorous ions are implanted at a low concentration to form LDD regions. By using a fourth mask, P ions are implanted at a high concentration to form source/drain regions of n-channel TFTs.

REFERENCES:
patent: 5146300 (1992-09-01), Hamamoto et al.
patent: 5399514 (1995-03-01), Ichikawa
patent: 6046484 (2000-04-01), Kodaira
patent: 2002/0182756 (2002-12-01), Kang
patent: 2003/0030115 (2003-02-01), Kikuchi et al.
patent: 2004/0179144 (2004-09-01), Jeon
patent: 03-006865 (1991-01-01), None
patent: 04-290467 (1992-10-01), None
patent: 11-135801 (1999-05-01), None
patent: 2001-092373 (2001-04-01), None

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