Thin film transistor panel and fabricating method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S023000, C438S034000, C438S099000

Reexamination Certificate

active

07968385

ABSTRACT:
A thin film transistor panel includes; an insulating substrate, a gate line including a gate electrode disposed on the insulating substrate, a gate insulating layer disposed on the gate electrode, a semiconductor layer disposed on the gate insulating layer, the semiconductor layer including a sidewall, a data line including a source electrode disposed on the semiconductor layer, a drain electrode disposed substantially opposite to and spaced apart from the source electrode, a first protective film disposed on the data line, the first protective film including a sidewall, a second protective film disposed on the first protective film and including a sidewall, and a pixel electrode electrically connected to the drain electrode, wherein the sidewall of the second protective film is disposed inside an area where the sidewall of the first protective film is disposed, and the source electrode and the drain electrode cover the sidewall of the semiconductor layer.

REFERENCES:
patent: 2009/0146147 (2009-06-01), Kim
patent: 2009/0188438 (2009-07-01), Schmucker
patent: 2010/0323482 (2010-12-01), Choi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film transistor panel and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film transistor panel and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistor panel and fabricating method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2687902

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.