Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-21
2010-02-16
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S040000, C438S673000, C438S924000, C257SE21214
Reexamination Certificate
active
07662715
ABSTRACT:
The present invention provides a TFT array panel and a manufacturing method of the same, which has signal lines including a lower layer of an Al containing metal and an upper layer of a molybdenum alloy (Mo-alloy) comprising molybdenum (Mo) and at least one of niobium (Nb), vanadium (V), and titanium (Ti). Accordingly, undercut, overhang, and mouse bites which may arise in an etching process, are prevented, and TFT array panels that have signal lines having low resistivity and good contact characteristics are provided.
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Bae Yang-Ho
Cho Beom-Seok
Jeong Chang-Oh
Lee Je-Hun
Innovation Counsel LLP
Louie Wai-Sing
Samsung Electronics Co,. Ltd.
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