Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1996-11-06
1999-12-28
Booth, Richard
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438164, H01L 2184
Patent
active
060080760
ABSTRACT:
A thin film transistor and a semiconductor device and a method for forming the same. A silicon thin film formed on an insulating substrate is heated at 550 to 800.degree. C. so that it has crystallinity, and a thin film transistor is formed using the crystalline silicon film thus obtained. Thermal contraction of the insulating substrate is set in a range of 30 to 500 ppm in the heating process, so that the thin film transistor has high mobility, low threshold voltage and high off-resistance. Thermal contraction of the insulating substrate may be also set 100 ppm or less in a heating process after a patterning treatment in a thin film transistor producing process.
REFERENCES:
patent: 4597160 (1986-07-01), Ipri
patent: 4693759 (1987-09-01), Noguchi et al.
patent: 4851363 (1989-07-01), Troxell et al.
patent: 5108843 (1992-04-01), Ohtaka et al.
patent: 5254208 (1993-10-01), Zhang
patent: 5294238 (1994-03-01), Fukada et al.
Wolf et al., "Silicon Processing for the VLSI Era", vol. I, pp. 468-473, 1986.
Codama Mitsufumi
Fukada Takeshi
Sakamoto Naoya
Yamauchi Yukio
Booth Richard
Costellia Jeffrey L.
Ferguson Jr. Gerald J.
Semicoductor Energy Laboratory Co., Ltd.
LandOfFree
Thin film transistor and semiconductor device and method for for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin film transistor and semiconductor device and method for for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistor and semiconductor device and method for for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2381694