Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2008-05-13
2008-05-13
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257S417000
Reexamination Certificate
active
07371600
ABSTRACT:
A thin-film structural body formed by using a semiconductor processing technique and a manufacturing method thereof, and particularly a thin-film structural body constituting a semiconductor acceleration sensor and a manufacturing method thereof. The thin-film structural body allows the thin-film member to be easily stress-controlled, and easily makes the film-thickness of the thin-film member thicker. The thin-film member forms a mass body and, beams and fixed electrodes of the semiconductor acceleration sensor are constituted by a plurality of doped polysilicon thin-films that are laminated by performing a step of film deposition of polysilicon while, for example, phosphorous is being doped as impurities plural times.
REFERENCES:
patent: 5298436 (1994-03-01), Radosevich et al.
patent: 5476819 (1995-12-01), Warren
patent: 5550009 (1996-08-01), Haye et al.
patent: 5550090 (1996-08-01), Ristic
patent: 5620931 (1997-04-01), Tsang et al.
patent: 5814834 (1998-09-01), Yamazaki et al.
patent: 5834071 (1998-11-01), Lin
patent: 5837619 (1998-11-01), Adachi et al.
patent: 5922212 (1999-07-01), Kano et al.
patent: 6199874 (2001-03-01), Galvin et al.
patent: 6240782 (2001-06-01), Kato et al.
patent: 6286369 (2001-09-01), Yazdi et al.
patent: 44 45 177 (1994-12-01), None
patent: 54-108582 (1979-08-01), None
patent: 09-260745 (1997-10-01), None
patent: 10-261806 (1998-09-01), None
patent: 2000-040830 (2000-02-01), None
patent: 2000-133818 (2000-05-01), None
patent: 2000-183364 (2000-06-01), None
patent: WO 00/42231 (2000-07-01), None
Aoto Masaaki
Horikawa Makio
Ishibashi Kiyoshi
Okumura Mika
Takakura Hirofumi
Doty Heather
Jr. Carl Whitehead
Mitsubishi Denki & Kabushiki Kaisha
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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