Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-11-21
2006-11-21
Wilson, Christian D. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S783000, C257S787000, C438S118000
Reexamination Certificate
active
07138724
ABSTRACT:
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured with corresponding contact areas of the carrier substrate. An assembly is formed by forming the solder mask on or securing the solder mask to the carrier substrate. The semiconductor die is attached to the carrier substrate such that bond pads of the semiconductor die are exposed through the aligned openings in the carrier substrate and solder mask. Intermediate conductive elements are used to electrically connect the bond pads to corresponding contact areas on the carrier substrate. An encapsulant material is introduced into an area defined by the solder mask and carrier substrate openings such that the intermediate conductive elements and semiconductor die surface within the aligned openings are encapsulated.
REFERENCES:
patent: 5181984 (1993-01-01), Matsumura et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5920118 (1999-07-01), Kong
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049129 (2000-04-01), Yew et al.
patent: 6150193 (2000-11-01), Glenn
patent: 6177723 (2001-01-01), Eng et al.
patent: 6214645 (2001-04-01), Kim
patent: 6246124 (2001-06-01), Jimarez et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6326698 (2001-12-01), Akram
patent: 6329224 (2001-12-01), Nguyen et al.
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6469897 (2002-10-01), Ho et al.
patent: 6479887 (2002-11-01), Yoon et al.
patent: 6506671 (2003-01-01), Grigg
patent: 6525408 (2003-02-01), Akram et al.
patent: 6531335 (2003-03-01), Grigg
patent: 6537842 (2003-03-01), Akram
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6548897 (2003-04-01), Grigg
patent: 6569753 (2003-05-01), Akram et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6611053 (2003-08-01), Akram
patent: 6630365 (2003-10-01), Farnworth et al.
patent: 6630730 (2003-10-01), Grigg
patent: 6649444 (2003-11-01), Earnworth et al.
patent: 6658314 (2003-12-01), Gothait
patent: 2002/0043711 (2002-04-01), Akram et al.
patent: 2002/0105074 (2002-08-01), Akram et al.
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0022462 (2003-01-01), Farnworth et al.
patent: 2003/0043360 (2003-03-01), Farnworth
patent: 2003/0068840 (2003-04-01), Grigg
patent: 2003/0089999 (2003-05-01), Akram
patent: 2003/0092220 (2003-05-01), Akram
patent: 2003/0098499 (2003-05-01), Akram et al.
patent: 2003/0139030 (2003-07-01), Grigg
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0170921 (2003-09-01), Akram
patent: 2003/0173665 (2003-09-01), Grigg
patent: 2003/0176016 (2003-09-01), Grigg
patent: 2003/0180974 (2003-09-01), Akram
patent: 2003/0181003 (2003-09-01), Akram
patent: 2003/0186496 (2003-10-01), Akram
patent: 2003/0193092 (2003-10-01), Tan et al.
patent: 2003/0203612 (2003-10-01), Akram et al.
patent: 2003/0207213 (2003-11-01), Farnworth
patent: 2004/0005770 (2004-01-01), Farnworth et al.
patent: 2004/0032020 (2004-02-01), Akram
patent: 2004/0077109 (2004-04-01), Tan et al.
patent: 2004/0142058 (2004-07-01), Farnworth
patent: 2004/0165362 (2004-08-01), Farnworth
patent: WO 97/01865 (1997-01-01), None
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Photopolymer materials and Support Resins, Objet Prototyping the Future, Object FullCure700 Series, 2 pages (2003).
Webpage, How it Works, Objet Prototyping the Future, 2 pages (2003).
Grigg Ford B.
Reeder William J.
Micro)n Technology, Inc.
TraskBritt
Wilson Christian D.
LandOfFree
Thick solder mask for confining encapsulant material over... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thick solder mask for confining encapsulant material over..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick solder mask for confining encapsulant material over... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3669426