4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Ford B. Grigg

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Encapsulation methods for semiconductive die packages

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Interposers including upwardly protruding dams,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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LOC semiconductor assembled with room temperature adhesive

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-925340

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