Thermally stable photoimaging composition

Details Thermally stable photoimaging composition Thermally stable photoimaging composition

1995-06-06

1997-09-09

Chapman, Mark

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

4302801, 430315, 522 31, 522170, G03C 500, C08F 246

Patent

active

056655266

ABSTRACT:
A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/.degree. C., which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.

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