Fluid handling – Destructible or deformable element controlled – Heat destructible or fusible
Reexamination Certificate
2011-06-14
2011-06-14
Rivell, John (Department: 3753)
Fluid handling
Destructible or deformable element controlled
Heat destructible or fusible
C137S067000, C251S011000
Reexamination Certificate
active
07958906
ABSTRACT:
In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
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Bumgarner John
Cardenas Michelle
Cardenas-Valencia Andres M.
Dlutowski Jay
Langebrake Larry
Rivell John
Sauter Molly L.
Smith & Hopen , P.A.
University of South Florida
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