Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-03-08
2011-03-08
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S120000, C438S121000, C438S126000, C438S637000, C438S622000, C257SE21499, C257SE21502, C257SE21575
Reexamination Certificate
active
07901984
ABSTRACT:
Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to a method for forming a microsystem and one or more passive devices in the microsystem. Layers of epoxy are sequentially deposited over a substrate to form multiple planarized layers of epoxy over the substrate. The epoxy layers are deposited by spin coating. At least some of the epoxy layers are photolithographically patterned after they are deposited and before the next epoxy layer is deposited. An integrated circuit having multiple I/O bond pads is placed on an associated epoxy layer. At least one conductive interconnect layer is formed over an associated epoxy layer. A passive component is formed within at least one of the epoxy layers. The passive component is electrically coupled with the integrated circuit via at least one of the interconnect layers. Multiple external package contacts are formed. The integrated circuit is electrically connected to the external package contacts at least partly through one or more of the conductive interconnect layers. Various embodiments pertain to apparatuses that are formed by performing some or all of the aforementioned operations.
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Deane Peter
Johnson Peter
Smeys Peter
Ahmadi Mohsen
Beyer Law Group LLP
Mulpuri Savitri
National Semiconductor Corporation
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