4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Tiao Zhou

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Apparatus and method for attaching an integrated circuit...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Apparatus and method for attaching an integrating circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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BGA/LGA with built in heat slug/spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Lead-frame forming for improved thermal performance

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method and system for exposed die molding for integrated...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2303446

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