Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Inventor
active
Electronic substrate having an aperture position through a...
Flip-chip ball grid array package with a heat slug
One-step bumping/bonding method for forming semiconductor...
One-step semiconductor stack packaging method
Stacked semiconductor package formed on a substrate and...
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Profile ID: LFUS-PAI-P-1161226