Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2006-12-05
2006-12-05
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S763000
Reexamination Certificate
active
07144823
ABSTRACT:
The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.
REFERENCES:
patent: 5578132 (1996-11-01), Yamaga et al.
patent: 5843794 (1998-12-01), Singer
patent: 6009831 (2000-01-01), Hwang
patent: 6026764 (2000-02-01), Hwang
patent: 6190460 (2001-02-01), Hwang
patent: 2004/0089654 (2004-05-01), Kitano et al.
patent: 2005/0255396 (2005-11-01), Kitano et al.
patent: 03-064912 (1991-03-01), None
patent: 07-245273 (1995-09-01), None
patent: 08-124866 (1996-05-01), None
patent: 09-082650 (1997-03-01), None
International Preliminary Examination Report (PCT/IPEA/409) (translated) issued for PCT/JP2002/10079.
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (PCT/IB/338) issued for PCT/JP2002/10079.
Hasebe Kazuhide
Makiya Toshiyuki
Osanai Hisaei
Saito Takanori
Saito Yukimasa
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