Thermal processing apparatus for semiconductor wafer

Heating – Work feeding – agitating – discharging or conveying... – Removable furnace bottom section or kiln cart

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432121, F27D 312

Patent

active

058996907

ABSTRACT:
An apparatus for thermal processing of semiconductor wafers includes a table having in lateral sequence a heating chamber, a holding chamber, and a cassette stage and a boat for holding the wafers being processed. The apparatus further includes a boat transfer part for moving the boat between the holding chamber and the heating chamber, a wafer charging part for transferring the wafers loaded in a cassette on the cassette stage to the boat while it is in the holding chamber, and a wafer discharging part for transferring the wafers loaded in the boat back to the cassette on the cassette stage.

REFERENCES:
patent: 5015177 (1991-05-01), Iwata
patent: 5202716 (1993-04-01), Tateyama et al.
patent: 5277579 (1994-01-01), Takanabe
patent: 5527390 (1996-06-01), Ono et al.
patent: 5645419 (1997-07-01), Ohsawa et al.
patent: 5697749 (1997-12-01), Iwabuchi et al.

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