4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Charles A. Gealer

Inventor

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active

Direct BGA attachment without solder reflow

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone
Reexamination Certificate

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Electronic packages with dice landed on wire bonds

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Thermal interface thickness control for a microprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Profile ID: LFUS-PAI-P-1395967

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