4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. Longitudinally progressive helical winding means

Chung-Lin Wu

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Device and method for optical nanoindentation measurement

Measuring and testing – Hardness – By penetrator or indentor
Reexamination Certificate

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Ion sensitive transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Responsive to non-optical – non-electrical signal
Reexamination Certificate

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Lead frame structure with aperture or groove for flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Lead frame structure with aperture or groove for flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Mandrel assembly

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Longitudinally progressive helical winding means
Patent

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Profile ID: LFUS-PAI-P-990131

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