Thermal-emitting memory module, thermal-emitting module...

Details Thermal-emitting memory module, thermal-emitting module... Thermal-emitting memory module, thermal-emitting module...

2008-07-29

2011-10-25

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257SE31131, C257SE23088, C257SE23097, C257SE23098, C361S679470, C174S015100, C174S015200

Reexamination Certificate

active

08044506

ABSTRACT:
The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device.

REFERENCES:
patent: 5239200 (1993-08-01), Messina et al.
patent: 2002/0053726 (2002-05-01), Mikubo et al.
patent: 2006/0012956 (2006-01-01), Hornung et al.
patent: 06132687 (1994-05-01), None
patent: 1020010040123 (2001-05-01), None

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