Thermal conditioning apparatus

Coating apparatus – Gas or vapor deposition

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118728, 118729, 118500, 118668, 269 21, 269292, 269903, 20429807, 432117, 432241, 156345, C23C 1600, C23C 1400, F27D 312, C23F 102

Patent

active

060902094

ABSTRACT:
A vapor control apparatus including an endless rim, a stagnation plate and a cover having an exhaust port. The endless rim has a first edge engaging the cover, a second edge opposite the first edge, an interior region and an exterior region defined by the rim and the cover, and a flow passage from the interior region to the exterior region adjacent the cover. The exhaust port is in fluid communication with the interior region and the second edge is seatable on a wafer support. A stagnation plate is disposed in the interior region, defining a stagnant region intermediate the stagnation plate and the surface, and defining at least one flow path in fluid communication with the stagnant region and the interior region.

REFERENCES:
patent: 3460822 (1969-08-01), Link
patent: 4512283 (1985-04-01), Bonifield et al.
patent: 4597569 (1986-07-01), Itamoto et al.
patent: 4640501 (1987-02-01), Poland
patent: 4671250 (1987-06-01), Hurley et al.
patent: 4684113 (1987-08-01), Douglas et al.
patent: 4693211 (1987-09-01), Ogami et al.
patent: 4838978 (1989-06-01), Sekine et al.
patent: 4869481 (1989-09-01), Yabu et al.
patent: 4870923 (1989-10-01), Sugimoto
patent: 4955590 (1990-09-01), Narushima et al.
patent: 5199483 (1993-04-01), Bahng
patent: 5374829 (1994-12-01), Sakamoto et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5389197 (1995-02-01), Ishimaru
patent: 5462603 (1995-10-01), Murakami
patent: 5484483 (1996-01-01), Kyogoku
patent: 5516367 (1996-05-01), Lei et al.
patent: 5534073 (1996-07-01), Kinoshita et al.
patent: 5564682 (1996-10-01), Tsuji
patent: 5569350 (1996-10-01), Osada et al.
patent: 5620523 (1997-04-01), Maeda et al.
patent: 5645646 (1997-07-01), Beinglass et al.
patent: 5660673 (1997-08-01), Miyoshi
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 5665167 (1997-09-01), Deguchi et al.
patent: 5669977 (1997-09-01), Shufflebotham et al.
patent: 5685914 (1997-11-01), Hills et al.
patent: 5695568 (1997-12-01), Sinha et al.
patent: 5700725 (1997-12-01), Hower et al.
patent: 5707051 (1998-01-01), Tsuji
patent: 5730801 (1998-03-01), Tepman et al.
patent: 5735960 (1998-04-01), Sandhu et al.
patent: 5738165 (1998-04-01), Imai
patent: 5796066 (1998-08-01), Guyot
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5823736 (1998-10-01), Matsumura
patent: 5858100 (1999-01-01), Maeda et al.
patent: 5861601 (1999-01-01), Sato et al.
patent: 5885353 (1999-03-01), Strodtbeck et al.
patent: 5928427 (1999-07-01), Hwang

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal conditioning apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal conditioning apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal conditioning apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2032497

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.