Testing and burn-in of IC chips using radio frequency transmissi

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

714733, 714 30, G01R 3128

Patent

active

061612057

ABSTRACT:
A testing system evaluates one or more integrated circuit chips using RF communication. The system includes an interrogator unit with a radio communication range, and an IC chip adapted with RF circuitry positioned remotely from the interrogator unit, but within the radio communication range. The interrogator unit transmits a power signal to energize the IC chip during test procedures, and interrogating information for evaluating the operation of the IC chip. Test results are transmitted by the IC chip back to the interrogator unit for examination to determine whether the IC chip has a defect. In this manner, one or more IC chips can be evaluated simultaneously without physically contacting each individual chip.

REFERENCES:
patent: 3689885 (1972-09-01), Kaplan et al.
patent: 4833402 (1989-05-01), Boegh-Petersen
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5164665 (1992-11-01), Yamashita et al.
patent: 5219765 (1993-06-01), Yoshida et al.
patent: 5252914 (1993-10-01), Bobbitt et al.
patent: 5303199 (1994-04-01), Ishihara et al.
patent: 5317255 (1994-05-01), Suyama et al.
patent: 5343478 (1994-08-01), James et al.
patent: 5448110 (1995-09-01), Tuttle et al.
patent: 5672981 (1997-09-01), Fehrman
patent: 5764655 (1998-06-01), Kirihata et al.
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5945834 (1999-08-01), Nakata et al.
patent: 5949246 (1999-09-01), Frankeny et al.
patent: 6058497 (2000-05-01), Tuttle
Osofsky & Schwarz, A non-contact probe for measurements on high-frequency planar circuits, IEEE MTT-S International Microwave Symposium Digest, pp. 823-825, Jun. 1989.
A Study on Accelerated Preconditioning Test, Yesbeng Sun et al., 1997 IEEE, pp. 98-101.
On Wafer Burn-In Strategies for MCM Die.sup.1, Adit D. Singh, MCM '94 Proceedings, pp. 255-260.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Testing and burn-in of IC chips using radio frequency transmissi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Testing and burn-in of IC chips using radio frequency transmissi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Testing and burn-in of IC chips using radio frequency transmissi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-226911

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.