Temporary package for at-speed functional test of...

Details Temporary package for at-speed functional test of... Temporary package for at-speed functional test of...

2011-06-14

2011-06-14

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S014000, C257SE21529, C257SE23080

Reexamination Certificate

active

07960190

ABSTRACT:
In some embodiments, a temporary package for at-speed functional test of semiconductor chip, including high power chips, is presented. In this regard, a method is introduced including placing an integrated circuit die on a contactor layer, the contactor layer to electrically couple contacts on the integrated circuit die with contacts on a multi-layer substrate designed to be permanently attached with the integrated circuit die, placing an integrated heat spreader over the integrated circuit die, and bonding the integrated heat spreader with the substrate, the integrated heat spreader holding the integrated circuit die in place to form a temporary package. Other embodiments are also disclosed and claimed.

REFERENCES:
patent: 6744269 (2004-06-01), Johnson et al.
patent: 2008/0238460 (2008-10-01), Chi et al.

Affiliated with

Also associated with

Rating

Temporary package for at-speed functional test of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Temporary package for at-speed functional test of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temporary package for at-speed functional test of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2720923