4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Pooya Tadayon

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Chip package enabling increased input/output density

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Electrical energy-generating heat sink system and method of...

Power plants – Motive fluid energized by externally applied heat – Process of power production or system operation
Reexamination Certificate

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Electrical energy-generating heat sink system and method of...

Power plants – Motive fluid energized by externally applied heat – Process of power production or system operation
Reexamination Certificate

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Electrical energy-generating system and devices and methods...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Temporary package for at-speed functional test of...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2320730

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