Template used for polishing a semiconductor wafer

Details Template used for polishing a semiconductor wafer Template used for polishing a semiconductor wafer

1997-05-30

1999-12-14

Eley, Timothy V.

Abrading

Work holder

Work rotating

451 63, 451288, B24B 3700

Patent

active

06001007&

ABSTRACT:
A backing pad 7 is secured on the bottom of a ceramic plate 6. A template 1 is secured on the bottom of the backing pad 7. The thickness of the template 1 successively diminishes from the inner periphery wall 12 of the central accommodation opening for restraining the semiconductor wafer, toward the outer periphery wall 13 of the template 1, so that the bottom of the template 1 is inclined and the cross section of the template 1 is tapered.

REFERENCES:
patent: 5267418 (1993-12-01), Currie et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5573448 (1996-11-01), Nakazima et al.
patent: 5645474 (1997-07-01), Kubo et al.

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