Temperature regulation in a CMP process

Abrading – Precision device or process - or with condition responsive... – Controlling temperature

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451 53, B24B 4914

Patent

active

060009977

ABSTRACT:
Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.

REFERENCES:
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5593344 (1997-01-01), Weldon et al.
patent: 5607341 (1997-03-01), Leach
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5762536 (1998-06-01), Pant et al.

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