Electric resistance heating devices – Heating devices – Radiant heater
Reexamination Certificate
2007-01-15
2010-12-28
Robinson, Daniel (Department: 3742)
Electric resistance heating devices
Heating devices
Radiant heater
C118S725000, C219S411000
Reexamination Certificate
active
07860379
ABSTRACT:
The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.
REFERENCES:
patent: 5755511 (1998-05-01), Peuse et al.
patent: 6566630 (2003-05-01), Kitamura
patent: 6692575 (2004-02-01), Omstead et al.
patent: 6800833 (2004-10-01), Gregor et al.
patent: 6803297 (2004-10-01), Jennings et al.
patent: 6916744 (2005-07-01), Achutharaman et al.
patent: 6927169 (2005-08-01), Maydan et al.
patent: 7022192 (2006-04-01), Dip et al.
patent: 2001/0034004 (2001-10-01), Kitamura
patent: 2005/0102108 (2005-05-01), Ramachandran et al.
patent: 2006/0018639 (2006-01-01), Ramamurthy et al.
patent: 2006/0066193 (2006-03-01), Ranish et al.
patent: 2006/0086713 (2006-04-01), Hunter et al.
patent: 2006/0223315 (2006-10-01), Yokota et al.
patent: 2006/0228818 (2006-10-01), Chacin et al.
patent: 2006/0240680 (2006-10-01), Yokota et al.
patent: 2008/0169282 (2008-07-01), Sorabji et al.
patent: 2008/0170842 (2008-07-01), Hunter et al.
patent: 2002-110583 (2002-04-01), None
patent: 10-2005-0062653 (2005-06-01), None
patent: WO-2006/004783 (2006-01-01), None
Office Action dated Aug. 28, 2009 for Korean Patent Application No. 10-2008-0003868.
Notification of the Office Rejection dated Mar. 18, 2010 for Chinese Patent Application No. 200810002374.1.
Office Action dated Aug. 21, 2009 for Chinese Patent Application No. 200810002374.1.
Adams Bruce E.
Behdjat Mehran
Hunter Aaron Muir
Ramanujam Rajesh S.
Ranish Joseph M.
Applied Materials Inc.
Patterson & Sheridan L.L.P.
Robinson Daniel
LandOfFree
Temperature measurement and control of wafer support in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Temperature measurement and control of wafer support in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temperature measurement and control of wafer support in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4204680