Thermal measuring and testing – Temperature measurement – Temperature distribution or profile
Patent
1995-06-30
1998-02-17
Bennett, G. Bradley
Thermal measuring and testing
Temperature measurement
Temperature distribution or profile
374162, G01K 300
Patent
active
057185115
ABSTRACT:
In a method for mapping temperatures reached by an object during heating, a thermally sensitive material which, when heated, undergoes a gradual irreversible change is applied to a surface of an object. The object and the material applied thereto are heated. An amount of irreversible change in the heated material applied on the object is determined, the amount of irreversible change in the heated material being indicative of temperatures reached at multiple points on the object.
REFERENCES:
patent: 3752915 (1973-08-01), Parker et al.
patent: 3817622 (1974-06-01), Billman et al.
patent: 3833851 (1974-09-01), Jobes, Jr. et al.
patent: 4064872 (1977-12-01), Caplan
patent: 4101696 (1978-07-01), Jennen et al.
patent: 4602981 (1986-07-01), Chen et al.
patent: 4675072 (1987-06-01), Bennett et al.
patent: 4682605 (1987-07-01), Hoffman
patent: 4687344 (1987-08-01), Lillquist
patent: 4696580 (1987-09-01), Kameda
patent: 4707147 (1987-11-01), Aoki et al.
patent: 4825447 (1989-04-01), Bramhall
patent: 4846920 (1989-07-01), Keller et al.
patent: 4902139 (1990-02-01), Adiutori
patent: 5045149 (1991-09-01), Nulty
patent: 5082517 (1992-01-01), Moslehi
patent: 5103182 (1992-04-01), Moslehi
patent: 5147520 (1992-09-01), Bobbio
patent: 5159564 (1992-10-01), Swartzel et al.
patent: 5167748 (1992-12-01), Hall
patent: 5444241 (1995-08-01), Del Grande et al.
Bennett G. Bradley
Lam Research Corporation
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