Temperature controlled hot edge ring assembly for reducing...

Details Temperature controlled hot edge ring assembly for reducing... Temperature controlled hot edge ring assembly for reducing...

2007-07-17

2007-07-17

MacArthur, Sylvia R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345470, C118S728000, C118S7230ER

Reexamination Certificate

active

10736666

ABSTRACT:
A temperature-controlled hot edge ring assembly adapted to surround a substrate support in a plasma reaction chamber. The assembly includes a conductive lower ring, a ceramic intermediate ring, and an upper ring. The intermediate ring overlies the lower ring and is adapted to be attached via the lower ring to an RF electrode. The upper ring overlies the intermediate ring, and has an upper surface exposed to an interior of a plasma reaction chamber.

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