Techniques for packaging a multiple device component

Details Techniques for packaging a multiple device component Techniques for packaging a multiple device component

2006-10-17

2006-10-17

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

07122404

ABSTRACT:
A technique for packaging multiple devices to form a multi-chip module. Specifically, a multi-chip package is coupled to an interposer to form the multi-chip module. The multi-chip package includes a plurality of integrated circuit chips coupled to a carrier. The chips are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The interposer is configured such that vias are aligned with the conductive elements. Conductive material may be disposed into the vias to provide signal paths from the integrated circuit chips to conductive balls disposed on the backside of the interposer.

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