Technique for increasing adhesion of metallization layers by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C257SE21579

Reexamination Certificate

active

07611991

ABSTRACT:
By providing dummy vias below electrically non-functional metal regions, the risk for metal delamination in subsequent processes may be significantly reduced. Moreover, in some embodiments, the mechanical strength of the resulting metallization layers may be even more enhanced by providing dummy metal regions, which may act as anchors for an overlying non-functional metal region. In addition, dummy vias may also be provided in combination with electrically functional metal lines and regions, thereby also enhancing the mechanical stability and the electrical performance thereof.

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patent: 2005/0121788 (2005-06-01), Watanabe et al.
patent: 2005/0142840 (2005-06-01), Fujimaki
patent: 2006/0145347 (2006-07-01), Aida
patent: 08097290 (1996-04-01), None
patent: 1020050062067 (2005-06-01), None
Search Report Dated Mar. 19, 2007 (US/06/044291).

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