Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-09-05
2009-11-03
Dang, Trung (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21579
Reexamination Certificate
active
07611991
ABSTRACT:
By providing dummy vias below electrically non-functional metal regions, the risk for metal delamination in subsequent processes may be significantly reduced. Moreover, in some embodiments, the mechanical strength of the resulting metallization layers may be even more enhanced by providing dummy metal regions, which may act as anchors for an overlying non-functional metal region. In addition, dummy vias may also be provided in combination with electrically functional metal lines and regions, thereby also enhancing the mechanical stability and the electrical performance thereof.
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Search Report Dated Mar. 19, 2007 (US/06/044291).
Claus Ellen
Langer Eckhard
Richter Ralf
Schaller Matthias
Advanced Micro Devices , Inc.
Dang Trung
Williams Morgan & Amerson P.C.
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