Technique for forming a transistor having raised drain and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21619

Reexamination Certificate

active

11280484

ABSTRACT:
By providing a hard mask layer stack including at least three different layers for patterning a gate electrode structure, constraints demanded by sophisticated lithography, as well as cap layer integrity, in a subsequent selective epitaxial growth process may be accomplished, thereby providing the potential for further device scaling of transistor devices requiring raised drain and source regions.

REFERENCES:
patent: 6573030 (2003-06-01), Fairbairn et al.
patent: 6800530 (2004-10-01), Lee et al.
patent: 7037794 (2006-05-01), Beintner et al.
patent: 7084071 (2006-08-01), Dakshina-Murthy et al.
patent: 2004/0137672 (2004-07-01), Lee et al.
patent: 0 517 627 (1992-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Technique for forming a transistor having raised drain and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Technique for forming a transistor having raised drain and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Technique for forming a transistor having raised drain and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3861989

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.