Technique for forming a contact insulation layer with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S510000, C438S649000

Reexamination Certificate

active

07354838

ABSTRACT:
By removing an outer spacer, used for the formation of highly complex lateral dopant profiles, prior to the formation of metal silicide, a high degree of process compatibility with conventional processes is obtained, while at the same time a contact liner layer may be positioned more closely to the channel region, thereby allowing a highly efficient stress transfer mechanism for creating a corresponding strain in the channel region.

REFERENCES:
patent: 5510648 (1996-04-01), Davies et al.
patent: 5841168 (1998-11-01), Gardner et al.
patent: 5960270 (1999-09-01), Misra et al.
patent: 5994747 (1999-11-01), Wu
patent: 6066567 (2000-05-01), En et al.
patent: 6087271 (2000-07-01), En et al.
patent: 6136636 (2000-10-01), Wu
patent: 6165826 (2000-12-01), Chau et al.
patent: 6271133 (2001-08-01), Lim et al.
patent: 6326664 (2001-12-01), Chau et al.
patent: 6335252 (2002-01-01), Oishi et al.
patent: 6372589 (2002-04-01), Yu
patent: 6573172 (2003-06-01), En et al.
patent: 6677201 (2004-01-01), Bu et al.
patent: 6770540 (2004-08-01), Ko
patent: 6878597 (2005-04-01), Kim
patent: 6969646 (2005-11-01), Quek et al.
patent: 7022596 (2006-04-01), Zhong et al.
patent: 2002/0192868 (2002-12-01), Kim
patent: 2003/0011017 (2003-01-01), Lee et al.
patent: 2003/0032239 (2003-02-01), Rabkin et al.
patent: 2003/0040158 (2003-02-01), Saitoh
patent: 2003/0183881 (2003-10-01), Lee et al.
patent: 2004/0072435 (2004-04-01), Quek
patent: 2004/0104405 (2004-06-01), Huang et al.
patent: 2004/0235229 (2004-11-01), Hokazono
patent: 2004/0251479 (2004-12-01), Tsutsui et al.
patent: 2004/0266124 (2004-12-01), Roy et al.
patent: 2005/0040472 (2005-02-01), Oh et al.
patent: 2005/0186722 (2005-08-01), Cheng et al.
patent: 2005/0266639 (2005-12-01), Frohberg et al.
patent: 2007/0194388 (2007-08-01), Tsutsui et al.
PCT Search Report, PCT/US2006/014627, Sep. 5, 2006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Technique for forming a contact insulation layer with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Technique for forming a contact insulation layer with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Technique for forming a contact insulation layer with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2777586

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.