Technique for efficient logic power gating with data...

Electronic digital logic circuitry – Signal sensitivity or transmission integrity – Signal level or switching threshold stabilization

Reexamination Certificate

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C326S033000, C327S530000, C365S226000

Reexamination Certificate

active

06512394

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates, in general, to the field of integrated circuit (“IC”) devices. More particularly, the present invention relates to a technique for efficient logic power gating with data retention for IC devices that have “active” and “standby” modes of operation.
Power gating peripheral logic blocks for IC memory devices are known. To date, attempts to reduce the leakage current for these circuits have exhibited two significant problems. First, even with extra power gating, the leakage current is still unacceptably high. Secondly, the state of the logic devices, latches, flip-flops, registers and the like is lost during the “standby”, or power-gated, mode.
U.S. Pat. No. 5,973,552 attempts to address the former problem by raising the gate voltage of the power gating devices to a boosted voltage level. This is effective in reducing the undesired current leakage (subthreshold current) of these devices but is a cumbersome process. The specification of this particular patent further describes a means for effectuating this end that minimizes the charge consumed out of the Vbb or Vpp supplies through the addition of more circuitry.
As to the latter problem, an article entitled “A Novell Powering-down Scheme for Low Vt CMOS Circuits” published in the 1998 Symposium on VLSI Circuits Digest of Technical Papers by Kumagai et al. outlines a way to maintain the logic states of power-gated logic that fails to work for low voltage complementary metal oxide semiconductor (“CMOS”) circuits. As described, the article particularly illustrates the use of PN diodes to clamp the internal power supplies to within a diode drop of the external power supplies. While this approach may be acceptable with respect to circuits which operate in the range of 1.5 volts, it fails to function for ultra low voltage designs in the range of 0.8 volts or lower.
Another article by Yamagata et al., “Circuit Design Techniques for Low-Voltage Operating and/or Giga-Scale DRAMs” published in the 1995 IEEE International Solid-State Circuits Conference (ISSCC) at pp. 248-249 illustrates logic transistor bodies tied to external supplies for different reasons such as the speed of entering and leaving a standby mode and not for the purpose of reducing current leakage in a standby mode.
SUMMARY OF THE INVENTION
The technique for efficient logic power gating with data retention for IC devices that have “active” and “standby” modes of operation in accordance with the present invention disclosed herein overcomes both of the aforementioned problems encountered in conventional approaches.
By way of background, the threshold voltage (“Vt”)of a metal oxide semiconductor (“MOS”) transistor is known to be affected by the voltage which is applied to the back contact, or “back gate”. The voltage difference between the source and the bulk (“V
BS
”) changes the width of the depletion layer and, therefore, also the voltage across the oxide due to the change of the charge in the depletion region. This is known as the “body effect”, or substrate bias effect, and stated another way, it is the variation of the threshold voltage of an MOS transistor due to a variation of the substrate or bulk voltage to the back contact.
In accordance with the technique of the present invention, the first mentioned problem inherent in prior approaches is solved using external voltage supplies (“VCC
EXT
” and “VSS
EXT
”) , wherein the Vt of the MOS devices is unaltered during “active” modes of operation when VCC
ext
=VCC
int
and VSS
ext
=VSS
int
(where “VCC
INT
” and “VSS
INT
” are the voltages on internal supply nodes) but the Vt will rise, reducing leakage, during “standby” mode when VCC
int
and VSS
int
drift towards each other due to the increased body effect. This constitutes, in essence, a positive feedback effect wherein, the more the logic devices leak, the more the internal voltage supplies will collapse, which increases the back gate voltage.
The latter identified problem of conventional designs is then overcome by using additional upper and lower MOS transistors nodes instead of PN diodes for coupling the external voltage supplies to the internal voltage. These additional devices serve to clamp the internal voltages to a level that will maintain the data in the logic circuits, since the Vt of the transistors can be made to be much less than 0.7 volts, the built in voltage of a diode.
Particularly disclosed herein is an integrated circuit logic device having supply and reference voltage input lines thereof. The integrated circuit device comprises an internal supply voltage node which is selectively couplable to the supply voltage line in response to an input signal supplied to a gate terminal of a first MOS transistor. An internal reference voltage node is also selectively couplable to the reference voltage line in response to a complement of the input signal supplied to a gate terminal of a second MOS transistor. A third MOS transistor is coupled in parallel with the first MOS transistor between the supply voltage line and the internal supply voltage node and has a gate terminal coupled to the supply voltage line and a back gate coupled to the internal supply voltage node. A fourth MOS transistor is coupled in parallel with the second MOS transistor between the reference voltage line and the internal reference voltage node and has a gate terminal coupled to the reference voltage line and a back gate coupled to the internal reference voltage node. A logic circuit comprising a plurality of logic gates is coupled between the internal supply voltage node and the internal reference voltage node.
Also disclosed herein is an integrated circuit device comprising a plurality of logic gates coupled between an internal supply voltage node and an internal reference voltage node. First and second parallel coupled MOS transistors couple a supply voltage line to the internal supply voltage node and third and fourth parallel coupled MOS transistors couple a reference voltage line to the internal reference voltage node. First and second complementary input lines are respectively coupled to gate terminals of the first and third MOS transistors while gate terminals of the second and fourth MOS transistors are coupled to the supply voltage line and the reference voltage line respectively.


REFERENCES:
patent: 5726946 (1998-03-01), Yamagata et al.
patent: 5801576 (1998-09-01), Ooishi
patent: 5973552 (1999-10-01), Allan
patent: 6384674 (2002-05-01), Tanizaki et al.
Kumagai, Kouichi; Hiroaki, Iwaki; Yoshida, Hiroshi; Suzuki, Hisamitsu; Yamada, Takashi; Kurosawa, Susumu; “A Novel Powering-down Scheme for Low Vt CMOS Circuits,” ULSI Device Development Laboratories, NEC Corporation, 1998 Symposium on VLSI Circuits Digest of Technical Papers, pp. 44-45.
Yamagata, Tadato; Tomishima, Shigeki; Tsukude, Masaki; Hashizume, Yasushi; Arimoto Kazutami; “Circuit Design Techniques for Low-Voltage Operating and/or Giga-Scale DRAMs”, ULSI Laboratory, Mitsubishi Electric Corporation, 1995 IEEE, pp. 248-249.

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