Technique for bonding a chip carrier to a metallized substrate

Details Technique for bonding a chip carrier to a metallized substrate Technique for bonding a chip carrier to a metallized substrate

1983-02-25

1985-04-23

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 491, B23K 3102, B01J 1700

Patent

active

045125090

ABSTRACT:
A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.

REFERENCES:
patent: 3387365 (1968-06-01), Stelmak
patent: 3429040 (1969-02-01), Miller
patent: 3457639 (1969-07-01), Weller
patent: 3480836 (1969-11-01), Aronstein
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3802069 (1974-04-01), Thompson
patent: 3869787 (1975-03-01), Umbaugh
patent: 3871936 (1975-03-01), Boyer et al.
patent: 3918146 (1975-11-01), Hartleroad et al.
patent: 3982979 (1976-09-01), Hentz et al.
patent: 4032058 (1977-06-01), Riseman
patent: 4079509 (1978-03-01), Jackson et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4334646 (1982-06-01), Campbell
patent: 4371912 (1983-02-01), Guzik
"Solder Reflow Face-Up Chip Mounting", IBM Technical Disclosure Bulletin, S. Magdo, vol. 19, No. 4, p. 1217, Sep. 1976.

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