4. Metal fusion bonding
  5. Process
  6. Plural joints

Brian E. Jacobs

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Single vapor condensation soldering facility

Heating – Processes of heating or heater operation – Controlling flame position or work atmosphere
Patent

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Technique for bonding a chip carrier to a metallized substrate

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-81433

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