4. Metal fusion bonding
  5. Process
  6. Plural joints

Roland Ellis, Jr.

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Semiconductor wafer cleaning method and apparatus

Cleaning and liquid contact with solids – Processes – With treating fluid motion
Patent

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Technique for bonding a chip carrier to a metallized substrate

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-81432

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