Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-10-24
2009-12-29
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S297000, C156S324000, C156S345420, C156S541000, C156S543000, C156S552000, C156S556000, C156S583200, C029S739000, C029S740000, C438S464000
Reexamination Certificate
active
07638013
ABSTRACT:
A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.
REFERENCES:
patent: 3724068 (1973-04-01), Galli
patent: 4653664 (1987-03-01), Hineno et al.
patent: 4829663 (1989-05-01), Masujima et al.
patent: 4915565 (1990-04-01), Bond et al.
patent: 5093984 (1992-03-01), Lape
patent: 5609292 (1997-03-01), Kohn
patent: 5809639 (1998-09-01), Alvite
patent: 5890794 (1999-04-01), Abtahi et al.
patent: 6364386 (2002-04-01), Quick et al.
patent: 6426552 (2002-07-01), Reeder et al.
patent: 6591486 (2003-07-01), Bolotin
patent: 6753614 (2004-06-01), Yamazaki et al.
patent: 7296963 (2007-11-01), Soto
patent: 2003/0140487 (2003-07-01), Plettner
patent: 0 542 093 (1992-11-01), None
patent: 0 949 858 (1999-10-01), None
International Search Report for PCT/US/38449 (mailing date Apr. 19, 2004).
Andrews Peter S.
Hiller Norbert
Negley Gerald H.
Slater, Jr. David B.
Chan Sing P
Cree Inc.
Myers Bigel Sibley & Sajovec P.A.
Tucker Philip C
LandOfFree
Systems for assembling components on submounts and methods... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems for assembling components on submounts and methods..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems for assembling components on submounts and methods... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4062868