4. Fishing, trapping, and vermin destroying

David B. Slater, Jr.

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Bonding of light emitting diodes having shaped substrates

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Cluster packaging of light emitting diodes

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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CMOS-compatible InP/InGaAs digital photoreceiver

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Light responsive structure
Patent

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Collets for bonding of light emitting diodes having shaped...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Heterojunction formed between semiconductor materials which...
Reexamination Certificate

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Flip-chip bonding of light emitting devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-514915

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