4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Incoherent light emitter structure
  6. With reflector, opaque mask, or optical element integral...

Peter S. Andrews

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Bonding of light emitting diodes having shaped substrates

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Cluster packaging of light emitting diodes

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Collets for bonding of light emitting diodes having shaped...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Heterojunction formed between semiconductor materials which...
Reexamination Certificate

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Flip-chip bonding of light emitting devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Flip-chip bonding of light emitting devices and light...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2212979

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