System to enable photolithography on severe structure...

Details System to enable photolithography on severe structure... System to enable photolithography on severe structure...

2005-01-04

2005-01-04

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S323000, C430S324000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06838228

ABSTRACT:
A system and related process to enable control of photolithographic pattern features on a structure having one or more severe non-flat topologies. The system includes an analysis of the Depth of Focus associated with photolithographic equipment and a photoresist film applied to the structure. From that determination a range of layout dimension of the topologies is identified accordingly and incorporated into the fabrication of such topologies. A conformal layer of material is then applied to the formed structure including the determined topologies to effectively substantially close up the topologies prior to application of the photoresist film. The system is suitable for use with any structure having severe topologies and photolithographic limitations including, for example, in the fabrication of micro-electro mechanical systems.

REFERENCES:
patent: 5481475 (1996-01-01), Young
patent: 5674773 (1997-10-01), Koh et al.
patent: 5804084 (1998-09-01), Nasby et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5963788 (1999-10-01), Barron et al.
patent: 6103399 (2000-08-01), Smela et al.
patent: 6355387 (2002-03-01), Fujinaga et al.
patent: 20030237064 (2003-12-01), White et al.
J.Olsen and F.Moghadam, “Planarization Techniques”, in Handbook of Multilevel Metallization for Integrated Circuits, S.R.Wilson and C.J.Tracy Eds.; Noyes, NY(1993), pp. 346-460.

Affiliated with

Also associated with

Rating

System to enable photolithography on severe structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System to enable photolithography on severe structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System to enable photolithography on severe structure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3373648