System for optically inspecting conditions of parts packaged on

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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Details

250235, 250561, G01B 1100, H01J 314, G01N 2186

Patent

active

052007995

ABSTRACT:
A system for inspecting a condition of parts packaged on a printed-circuit board. The inspection system includes a position detecting device to receive scattered light due to illumination of the printed-circuit board with a laser beam and convert the received scattered light into a position signal. This position signal is used for obtaining luminance data and at least two height data of the parts on the printed-circuit board. Proper height data of the parts is determined on the basis of the difference between the two height data. The inspection system determines the package condition by comparing the final height data with a predetermined reference data.

REFERENCES:
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patent: 4674869 (1987-06-01), Pryor et al.
patent: 4796997 (1989-01-01), Svetkoff et al.
patent: 4910690 (1990-03-01), Fujita
patent: 4983827 (1991-01-01), Ikegaya et al.
patent: 5004929 (1991-04-01), Kakinoki et al.
patent: 5027418 (1991-06-01), Ikegaya et al.
patent: 5103105 (1992-04-01), Ikegaya et al.
Patent Abstracts of Japan vol. 11, No. 62 (P-551 ) (2509), Feb. 25, 1987 and JP-A-61225606 (Sumitomo Metal) Jul. 10, 1986.

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