System for locating conductive sphere utilizing screen and...

Details System for locating conductive sphere utilizing screen and... System for locating conductive sphere utilizing screen and...

2000-05-23

2009-12-22

Trinh, Minh (Department: 3729)

Metal fusion bonding

Process

Preplacing solid filler

C029S783000, C029S843000, C228S246000, C228S041000, C228S056300

Reexamination Certificate

active

07635079

ABSTRACT:
System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

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