System and method to customize bond programs compensating...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S003000

Reexamination Certificate

active

07069102

ABSTRACT:
A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.

REFERENCES:
patent: 5516023 (1996-05-01), Kono
patent: 5579984 (1996-12-01), Sasano
patent: 5615821 (1997-04-01), Sasano
patent: 5862974 (1999-01-01), Sasano
patent: 5963451 (1999-10-01), Seki et al.
patent: 6198981 (2001-03-01), Nakamura et al.
patent: 6429187 (2002-08-01), Sontheimer et al.
patent: 6467673 (2002-10-01), Enokido et al.
patent: 6597963 (2003-07-01), Koduri et al.
patent: 6629013 (2003-09-01), Koduri et al.
patent: 2001/0044669 (2001-11-01), Koduri et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method to customize bond programs compensating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method to customize bond programs compensating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method to customize bond programs compensating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3657185

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.