Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-10-29
2010-06-15
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
07739632
ABSTRACT:
A system and method to optimize a circuit layout, and more particularly, to a system and method of post layout data preparation to optimize a circuit layout and reduce random and systematic wire and via opens and shorts. The method includes stripping existing vias in a design layout and determining design parameters of the design layout including wiring placement and dimensions. The method further includes optimizing via layout by placing vias away from edges of the wiring and adjacent vias. The invention is also directed to a design structure on which a circuit resides.
REFERENCES:
patent: 5729466 (1998-03-01), Bamji
patent: 5737580 (1998-04-01), Hathaway et al.
patent: 5798937 (1998-08-01), Bracha et al.
patent: 5835378 (1998-11-01), Scepanovic et al.
patent: 6026224 (2000-02-01), Darden et al.
patent: 6247853 (2001-06-01), Papadopoulou et al.
patent: 6470476 (2002-10-01), Bednar et al.
patent: 6507930 (2003-01-01), Bass, Jr. et al.
patent: 6941528 (2005-09-01), Allen et al.
patent: 7117468 (2006-10-01), Teig et al.
patent: 7284231 (2007-10-01), Lucas et al.
patent: 7312141 (2007-12-01), Dunham et al.
Office Action for U.S. Appl. No. 11/465,473, dated Sep. 22, 2008.
Office Action dated Apr. 7, 2009 in U.S. Appl. No. 11/465,473.
Office Action dated Oct. 16, 2009 in U.S. Appl. No. 11/465,473.
Bergman Reuter Bette L
Landis Howard S.
Stamper Anthony K.
Sucharitaves Jeanne-Tania
Bowers Brandon W
Chiang Jack
Greenblum & Bernstein P.L.C.
International Business Machines - Corporation
Kotulak Richard
LandOfFree
System and method of automated wire and via layout... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method of automated wire and via layout..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method of automated wire and via layout... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4239737