System and method for processing workpieces

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

118720, 156643, 20419211, 20419212, 20419225, 204298, 427 34, 427 39, 437225, C23C 1400

Patent

active

047174617

ABSTRACT:
A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.

REFERENCES:
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4534314 (1985-08-01), Ackley
patent: 4560462 (1985-12-01), Radford
patent: 4587002 (1986-05-01), Bok
patent: 4622918 (1986-11-01), Bok
patent: 4650064 (1987-03-01), Slabaugh
patent: 4661228 (1987-04-01), Mintz

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