System and method for monitoring manufacturing apparatuses

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S121000

Reexamination Certificate

active

11068778

ABSTRACT:
A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

REFERENCES:
patent: 6842866 (2005-01-01), Song et al.
patent: 7043384 (2006-05-01), Matsushita et al.
patent: 2003/0011376 (2003-01-01), Matsushita et al.
patent: 2004/0049722 (2004-03-01), Matsushita
patent: 2002-359266 (2002-12-01), None
H. Matsushita et al., “Highly Sensitive Inspection System for Lithography-Related Faults in Agile-Fab—Detecting Algorithm for Monitoring and Evaluation of Yield Impact,” IEEE Transactions on Semiconductor Manufacturing (Nov. 2002), 15:506-512.
H. Matsushita et al., “New Method of Classification System for Wafer Maps,” Proceedings of ISSM (2004), pp. 482-485.

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