System and method for forming one or more integrated circuit...

Details System and method for forming one or more integrated circuit... System and method for forming one or more integrated circuit...

2006-11-07

2006-11-07

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S666000, C257S735000

Reexamination Certificate

active

07132314

ABSTRACT:
In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated with an integrated circuit at one or more of the lead bars such that the one or more lead bars extend from opposite sides of the die. The leadframe structure also includes one or more support structures (e.g. lead support bars26) adapted to help hold the lead bars together.

REFERENCES:
patent: 2002/0024121 (2002-02-01), Matumoto
patent: 2005/0098859 (2005-05-01), Hasegawa
patent: 2005/0258520 (2005-11-01), Dolan

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