System and method for etching a mask

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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Reexamination Certificate

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06893975

ABSTRACT:
A system and method for transferring a pattern from an overlying layer into an underlying layer, while laterally trimming a feature present within the pattern is described. The pattern transfer is performed using an etch process according to a process recipe, wherein at least one variable parameter within the process recipe is adjusted given a target trim amount. The adjustment of the variable parameter is achieved using a process model established for relating trim amount data with the variable parameter.

REFERENCES:
patent: 6235609 (2001-05-01), Sengupta et al.
patent: 6716570 (2004-04-01), Nagarajan et al.

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