Semiconductor device manufacturing: process – Radiation or energy treatment modifying properties of...
Reexamination Certificate
2006-09-05
2006-09-05
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Radiation or energy treatment modifying properties of...
C438S014000, C438S799000
Reexamination Certificate
active
07101817
ABSTRACT:
A apparatus and method for determining minimum line widths of free standing structures built by a semiconductor (S/C) manufacturing process. Free standing structures are created in a semiconductor device and subjected to an aerosol process which is tuned and centered with respect to a critical line width for the free standing structures. The S/C manufacturing process is tuned responsive to failure of free standing structures of sub-critical line widths.
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James F. Weygand, et al.Cleaning silicon wafers with an argon
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FSI International, Inc.Glossary.Accessed Jun. 17, 2004 at http://www.fsik-intl.com/products/glossary.php.
Barth Karl W.
Loh Stephen K.
Lucarini Stephen M.
Dang Phuc T.
International Business Machines - Corporation
Jaklitsch Lisa U.
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